Texas Instruments breaks ground on new 300-mm semiconductor wafer fabrication plants in Sherman, Texas
Texas Instruments (TI) on 18 May broke ground on its new 300-mm semiconductor wafer fabrication plants (fabs) in Sherman, Texas. Production from the first Sherman fab is expected in 2025. The fabs will complement TI’s existing 300-mm fabs, which include DMOS6, RFAB1 and the soon-to-be-completed RFAB2 which is expected to start production later this year.
