The Future of Semiconductor Supply Chain Resiliency

On Monday, 5 February, AMCHAM was host to a special roundtable, “The Future of Semiconductor Supply Chain Resiliency,” which was a joint collaboration between the Ministry of Investment, Trade, and Industry (MITI),  the U.S. Commerce Department and based on the Memorandum of Cooperation that was signed in 2021 by Gina Raimondo, Secretary, U.S. Department of Commerce. 

The event was attended by Ambassador-designate Edgard D. Kagan, Deputy Minister of MITI, YB Liew Chin Tong, members of the semiconductor industry, both American and Malaysian, along with representatives from both MITI and the U.S. Embassy. The session was moderated by Dato’ Seri Wong Siew Hai, the president of the MSIA.

The overall objective of the session was to facilitate a deeper understanding of the challenges faced by businesses in Malaysia. Additionally, it sought to explore ways in which the U.S. government could collaborate with Malaysian counterparts to ensure a resilient and effective semiconductor supply chain.

The discussion focused on Environmental, Social, and Governance (ESG) considerations and the needs of Small and Medium Enterprises (SMEs) in the semiconductor industry.