ASE Breaks Ground on New Chip Assembly and Testing Facility in Penang, Malaysia
ASE Breaks Ground on New Chip Assembly and Testing Facility in Penang, Malaysia
PENANG, Malaysia, November 10th, 2022 – Advanced Semiconductor Engineering, Inc. (ASE, a member of ASE Technology Holding Inc, NYSE: ASX, TWSE: 3711) hosted a groundbreaking ceremony today for the construction of a new semiconductor assembly and testing facility in Penang, Malaysia. The new facility at ASE Malaysia (ASEM) will comprise 2 buildings (Plants 4 and 5) with a built-up area of 982,000 square feet, located in the Bayan Lepas Free Industrial Zone.
The semiconductor industry has witnessed rapid growth driven by demands from 5G, AI, high performance computing and automotive electronic developments. Outsourced semiconductor assembly and test (OSAT) manufacturing continues to form a critical link in the global electronics supply chain. As a leading OSAT player, ASEM has been serving major semiconductor companies that supply advanced chips in consumer, communication, industrial and automotive applications since 1991. Over the decades, the company has strategically deployed capital investments as it captures more market share and extend the breadth and depth of its service offerings.